Our emerging technology capabilities support the most advanced PCB designs and we recommend having a DFM completed by Streamline Circuit’s pre-engineering team. Listed below is a detailed list of our capabilities and design guidelines. Keeping your designs within our standard and advanced capabilities will yield the most competitive pricing.

Rigid PCBs

To jump to a specific section, use the links below.

Laminate MaterialsLines, Spaces, & Pad DiametersElectroplatingConductor Finishes

Lead Free Finishes  | Tolerances  | Via CapabilitiesSoldermask and Legend


Standard

Advanced

Emerging

Panel Size18″ X 24″ & 19″ X 25″

21″ X 24″ & 24″ X 30″

 21″ X 24″ & 24″ X 30″
Layer Count2 to 36

48+

60+
Laminate Materials
FR4 Tg 140Yes

Yes

Yes
FR4 Tg 170Yes

Yes

Yes
GETEKYes

Yes

Yes
RogersYes

Yes

Yes
PolyimideYes

Yes

Yes
DuroidYes

Yes

Yes
RoHs MaterialsYes

Yes

Yes
Polyclad 370 HRYes

Yes

Yes
Isola 410Yes

Yes

Yes
TUCYes

Yes

Yes
Halogen FreeYes

Yes

Yes
StablcorYes

Yes

Yes
Exotic Material TypesYes

35+

40+
Finished Thickness [Multilayer].005″ to .220″

.220″-.250″

Greater than .250″
Minimum Core Thickness.002″

.002″

.001″
Finished Thickness Tolerance [+/-]10%

7%

5%
Multiple Laminations5

9

12+
Copper Foil Weights Internal1/4 to 2

Up to 6 ounce

Up to 6 ounce
Copper Foil Weights External1/4 to 3

Up to 4 ounce

Greater than 6 ounce
Lines, Spaces, & Pad Diameters
Internal Line Width.0035″

.002”

Less than .002″
Internal Spacing.0035″

.002″

Less than .002″
External Line Width.0035″

.002″

Less than .002″
External Spacing.0035″

.002″

Less than .002″
Int. Pad Size-A/R Per Side (Fin.-.001).005″

.004″

Less than .004″
Ext. Pad Size-A/R Per Side (Fin.-.002).003″

.003″

Less than .003″
SMT Pitch.010″

.010″

Less than .010″
Impedance10%

5%

Greater than 5%
Electroplating
Tin Lead Plating Thickness.0003″-.0005″

Greater than .0005″

Greater than .0005″
Tin Nickel Plating Thickness150Microinches

250 Microinches

Greater than 250 Microinches
Low Stress Nickel100 Microinches

250 Microinches

Greater than 250 Microinches
Gold Plating Thickness30 Microinches

As Specified

As Specified
Minimum Drilled Hole Size0.012

.0098″

Less than .0059″
Hole Aspect Ratio10 to 1

15 to 1

Less than 20 to 1
Conductor Finishes
HASLYes

Yes

Yes
Solder with ReflowYes

Yes

Yes
White TinYes

Yes

Yes
Carbon InkYes

Yes

Yes
Lead Free Finishes
Electroless Nickel/Paladium/GoldYes

Yes

Yes
Electroless Nickel/Immersion GoldYes

Yes

Yes
Immersion SilverYes

Yes

Yes
Entek Plus HTYes

Yes

Yes
HASLYes

Yes

Yes
Tolerances
Drilled Hole To Copper.008″

.007″

.006″
Non Plated Hole Tolerances [+/-].001″

.001″

Less than .001″
Fabrication Tolerances [+/-].005″

.003″

Less than .003″
Via Capabilities
Laser Micro Vias.004″

.002″

Less than .002″
Blind/Buried Vias.004″

.002″

Less than .002″
Via Under PADYes

Yes

Yes
Back DrillYes

Yes

.008″ larger than Primary Drill
Back drill AntipadYes

Yes

.020″ larger than Primary Drill
CastellationYes

Yes

Yes
Laser Drill.004

.002

Less than .002
Mechanical Vias.0059

.0047

Less than .0047
Tented LPICoated With LPI

Coated/plugged

Coated/plugged
Plugged UV Curable [no solvent]Maximum .020″

Yes

Yes
Silver Conductive Via FillYes

Yes

Yes
Non-Conductive ViaFillYes

Yes

Yes
Soldermask and Legend
Minimum Mask Clearance [LPI].003″

.002″

Less than .002″
Minimum Soldermask Thickness0.0004″

0.0004″

0.0004″
Gasketed Chip Scale Packaging.002″

.001″

Less than .001″
Soldermask TypeLPI

Dry Film

As required
Soldermask ColorGreen

Any Color

Any Color
Soldermask Web Minimum.004″

.003″

Less than .003″
Legend ColorWhite

Any Color

Any Color
Legend Feature Size.008″ wide x .030″ high

.006″ wide x .03″ high min

LPI Legend .003″ x .02″
Flatness (Symmetrical construction)IPC Standard

Review Required

Review Required

Return to top