Design Guidelines and Manufacturing Capabilities

Listed below is a detailed list of our capabilities and design guidelines. Keeping your designs within our standard and advanced capabilities will yield the most competitive pricing. Our emerging technology capabilities support the most advanced PCB designs and we recommend having a DFM completed by Streamline Circuit’s pre-engineering team.

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Multiple LaminationLines, Spaces, & Pad Diameters | Via Hole FinishSurface FinishElectroless Nickel/Immersion GoldTolerances

Standard Advanced
Single-Side Flexible Panel Size 12” X 18” & 18″ X 24″ 21″ X 24″ & 24″ X 36″
Double-Side Flexible Panel Size 12” X 18” 24” X 36”
Multi-Layer Flex Panel Size 12” X 18” 18” X 24” and Up
Layer Count 3 to 12 14 to 20+
Rigid Flex Panel Size 12” X 18” 18” X 24” and Up
Multiple Lamination
Copper Foil Weights Internal/External ¼ to 2 ounce Up to 3 ounce
Kapton Polyimide Stiffener .001” to .007” .008” and Up
Polyimide Rigid Stiffener .003” to .062” .063” and Up
Lines, Spaces & Pad Diameters
Internal Line Width .0035″ .002”
Internal Spacing .0035″ .002″
External Line Width .0035″ .002″
External Spacing .0035″ .002″
SMT Pitch .010″ .010″
Impedance 10% 5%
Via Hole Finish
Laser Micro Vias .004” .002”
Blind/Buried Vias .004” .002”
Laser Drill .004” .002”
Minimum Drilled Hole Size .012” .0079”
Drilled Hole to Copper .008” .007”
Castellation Yes Yes
Surface Finish
Tin Lead Plating Thickness .0003” to .0005” Less than .0005”
Tin Nickel Plating Thickness 150 Micro Inches 250 Micro Inches
Low Stress Nickel 100 Micro Inches 250 Micro Inches
Gold Plating Thickness 30 Micro Inches As Specified
Electroless Nickel/Immersion Gold Yes Yes
Electroless Nickel/Palladium/Gold Yes Yes
Immersion Silver Yes Yes
Entek Plus HT Yes Yes
HASL Yes Yes
Tolerances
Plated Hole Tolerances [+/-] .002″ .001″
Non Plated Hole Tolerances [+/-] .001″ .001″
Fabrication Tolerances [+/-] .005″ .003″
Vision Rout [+/-] .003″ .002″
Laser Rout [+/-] .002” .001″

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