Design Guidelines and Manufacturing Capabilities

Listed below is a detailed list of our capabilities and design guidelines. Keeping your designs within our standard and advanced capabilities will yield the most competitive pricing. Our emerging technology capabilities support the most advanced PCB designs and we recommend having a DFM completed by Streamline Circuit’s pre-engineering team.

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Laminate MaterialsLines, Spaces, & Pad DiametersElectroplatingConductor Finishes

Lead Free Finishes  | Tolerances  | Via CapabilitiesSoldermask and Legend


Standard

Advanced

Emerging

Panel Size 18″ X 24″ & 19″ X 25″

21″ X 24″ & 24″ X 30″

 21″ X 24″ & 24″ X 30″
Layer Count 2 to 36

48+

60+
Laminate Materials
FR4 Tg 140 Yes

Yes

Yes
FR4 Tg 170 Yes

Yes

Yes
GETEK Yes

Yes

Yes
Rogers Yes

Yes

Yes
Polyimide Yes

Yes

Yes
Duroid Yes

Yes

Yes
RoHs Materials Yes

Yes

Yes
Polyclad 370 HR Yes

Yes

Yes
Isola 410 Yes

Yes

Yes
TUC Yes

Yes

Yes
Halogen Free Yes

Yes

Yes
Stablcor Yes

Yes

Yes
Exotic Material Types Yes

35+

40+
Finished Thickness [Multilayer] .005″ to .220″

.220″-.250″

Greater than .250″
Minimum Core Thickness .002″

.002″

.001″
Finished Thickness Tolerance [+/-] 10%

7%

5%
Multiple Laminations 5

9

12+
Copper Foil Weights Internal 1/4 to 2

Up to 6 ounce

Up to 6 ounce
Copper Foil Weights External 1/4 to 3

Up to 4 ounce

Greater than 6 ounce
Lines, Spaces, & Pad Diameters
Internal Line Width .0035″

.002”

Less than .002″
Internal Spacing .0035″

.002″

Less than .002″
External Line Width .0035″

.002″

Less than .002″
External Spacing .0035″

.002″

Less than .002″
Int. Pad Size-A/R Per Side (Fin.-.001) .005″

.004″

Less than .004″
Ext. Pad Size-A/R Per Side (Fin.-.002) .003″

.003″

Less than .003″
SMT Pitch .010″

.010″

Less than .010″
Impedance 10%

5%

Greater than 5%
Electroplating
Tin Lead Plating Thickness .0003″-.0005″

Greater than .0005″

Greater than .0005″
Tin Nickel Plating Thickness 150Microinches

250 Microinches

Greater than 250 Microinches
Low Stress Nickel 100 Microinches

250 Microinches

Greater than 250 Microinches
Gold Plating Thickness 30 Microinches

As Specified

As Specified
Minimum Drilled Hole Size 0.012

.0098″

Less than .0059″
Hole Aspect Ratio 10 to 1

15 to 1

Less than 20 to 1
Conductor Finishes
HASL Yes

Yes

Yes
Solder with Reflow Yes

Yes

Yes
White Tin Yes

Yes

Yes
Carbon Ink Yes

Yes

Yes
Lead Free Finishes
Electroless Nickel/Paladium/Gold Yes

Yes

Yes
Electroless Nickel/Immersion Gold Yes

Yes

Yes
Immersion Silver Yes

Yes

Yes
Entek Plus HT Yes

Yes

Yes
HASL Yes

Yes

Yes
Tolerances
Drilled Hole To Copper .008″

.007″

.006″
Non Plated Hole Tolerances [+/-] .001″

.001″

Less than .001″
Fabrication Tolerances [+/-] .005″

.003″

Less than .003″
Via Capabilities
Laser Micro Vias .004″

.002″

Less than .002″
Blind/Buried Vias .004″

.002″

Less than .002″
Via Under PAD Yes

Yes

Yes
Back Drill Yes

Yes

.008″ larger than Primary Drill
Back drill Antipad Yes

Yes

.020″ larger than Primary Drill
Castellation Yes

Yes

Yes
Laser Drill .004

.002

Less than .002
Mechanical Vias .0059

.0047

Less than .0047
Tented LPI Coated With LPI

Coated/plugged

Coated/plugged
Plugged UV Curable [no solvent] Maximum .020″

Yes

Yes
Silver Conductive Via Fill Yes

Yes

Yes
Non-Conductive ViaFill Yes

Yes

Yes
Soldermask and Legend
Minimum Mask Clearance [LPI] .003″

.002″

Less than .002″
Minimum Soldermask Thickness 0.0004″

0.0004″

0.0004″
Gasketed Chip Scale Packaging .002″

.001″

Less than .001″
Soldermask Type LPI

Dry Film

As required
Soldermask Color Green

Any Color

Any Color
Soldermask Web Minimum .004″

.003″

Less than .003″
Legend Color White

Any Color

Any Color
Legend Feature Size .008″ wide x .030″ high

.006″ wide x .03″ high min

LPI Legend .003″ x .02″
Flatness (Symmetrical construction) IPC Standard

Review Required

Review Required

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